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Advanced Packaging Technology

Cyntec’s technology platform of Electronic Materials Packaging for High Power Circuits, Heat Sink Design Simulation and High Current Metal Lead Frame, allowed us to produce a wide variety of Power Modules.


Material:
Embedded substrate lamination material
Copper lead frame surface treatment
Ceramic substrate for direct copper bonding
Encapsulation molding compound

Design & Simulation:
Power topology design and optimization
Multi-physics coupling co-simulation
Molding cavity design and mold ¬flow simulation

Process
Embedded active/passive 3D packaging
Thin lm photolithography and electroplating
Encapsulation process (molding, casing, dispensing)
High density laser drilled via connections
Au/Al wire bonding interconnection
High precision die attaching
High temp soldering SMT and vacuum re¬flow

Analysis
Packaging structure (X-ray, De-capsulation)
Material property (SEM, EDX)
Semiconductor reliability (EMMI, OBIRCH)
Adhesion and thermal expansion property analysis
Thermal conductivity and electrical isolation


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